Journal of Integrated Design & Process Science

Transactions of the SDPS

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ISSN print
1092-0617
ISSN online
1875-8959
Volume
22; 4 issues
Status
Last issue (21:3) online on 24 November 2017
Next issue
21:4 scheduled for February 2018
Back volumes
1-21
Website
www.sdpsnet.org
Subject
Computer Science, Engineering, Management Science
Institutional subscription for 2018 €435 / US$550 Excluding VAT
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Call for Papers Special Issue on Advanced and Emerging Design Applications of Additive Manufacturing Technologies. Click here for details. First submission due: 30 September 2017.

Call for Papers Special Issue on Advances in Big Data Analytics and Cloud Computing for Transdisciplinary Design. Click here for details.

The Journal of Integrated Design and Process Science (JIDPS) is the official journal of the Society for Design and Process Science (SDPS). This journal publishes research findings covering transdisciplinary notions of design and process with a focus on issues that deal with 1) understanding of design and process  crossing boundaries of natural, human, and built environments,  2) principles, methods, and tools, and 3) applications of design and process science to engineering and social problems. The journal serves to promote research of transdisciplinary design and process science from different disciplines such as mathematics, computer science, economics, engineering, management science, natural sciences, and social sciences.

The journal is an archival peer-reviewed technical journal publishing the following papers: 1) research papers, 2) reports on case studies, 3) reports on major design and process projects, 4) design and process standards and proposals, 5) literature review, and 6) discussion and position papers that discuss the works published in the journal or present retrospections on critical and strategic issues in the transdisciplinary design and process science. 

Editor-in-Chief
Yong Zeng
Design Science
Concordia University, Montreal, Canada
E-mail: yong.zeng@concordia.ca

Co-Editor-in-Chief
Kyoung-yun Kim
Industrial and Systems Engineering
Wayne State University
Detroit, USA
E-mail: kykim@eng.wayne.edu

Associate Editors

Gaetano Cascini
Department of Mechanical Engineering
Politecnico di Milano
Milano, Italy
E-mail: gaetano.cascini@polimi.it

Jingwei Huang
Systems Engineering
Old Dominion University, Norfolk, USA
Email: j2huang@odu.edu

Radmila Juric
Software Engineering
The University College of Southeast Norway, Norway
Email: Radmila.Juric@usn.no

Honorary Editor
Peter A. Ng
Department of Computer Science
Indiana University Purdue University Fort Wayne, Fort Wayne, USA
E-mail: ngp@ipfw.edu 

Stephen Ekwaro-Osire
Mechanical Engineering
Texas Tech University, Lubbock, USA
E-mail: stephen.ekwaro-osire@ttu.edu

Proof Editor

Mengting Zhao
Information Systems Engineering
Concordia University, Montreal, Canada
E-mail: z_mengti@encs.concordia.ca

Editorial Board
A.A. Arntzen
The University College of Southeast Norway, Norway

A. Chakrabarti
Indian Institute of Science, Bangalore, India

C.-H. Chu
National Tsing Hua University, Hsinchu, Taiwan

E. Coatanéa
Tampere University of Technology, Tampere, Finland

F. Demoly
Univ. Bourgogne Franche-Comté, UTBM, France

A. Dogru
Middle East Technical University, Ankara, Turkey

R. De Guio
INSA de Strasbourg, France

I. Horváth,
Delft University of Technology, The Netherlands

G.E. Kremer
Iowa State University, USA

S. Liu
Central China Normal University, Wuhan, China

Y. Liu
Cardiff University, Cardiff, UK

S. McCahan
University of Toronto, Canada

V. Raskin
Purdue University, West Lafayette, USA

Y. Reich
Tel Aviv University, Tel Aviv, Israel

M. Steinert
Norwegian University of Science and Technology (NTNU), Trondheim, Norway

T. Tomiyama
Cranfield University, Cranfield. UK

T. Wan
University of Central Florida, Orlando, FL, USA

Senior Advisory Board 
Nam P. Suh
Former President of KAIST, S. Korea
Professor Emeritus, Massachusetts Institute of Technology, USA

Sang C. Suh
Computer Science
Texas A&M-Commerce, Texas, USA

Murat Tanik
Electrical Engineering
Wallace R. Bunn Chair of Telecommunications, The University of Alabama at Birmingham, USA

Raymond T. Yeh
USA

Outreach Committee Chairs
Varadraj Prabhu
University of Central Florida, USA

David Robbins
Samford University, USA

Patrick HangHui Then
Swinburne University of Technology, Malaysia

Fan Xiong
Bio-Rad Laboratories, USA

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