Journal of Integrated Design & Process Science

Transactions of the SDPS

Share this journal
ISSN print
ISSN online
23; 4 issues
Last issue (22:2) online on 28 May 2019
Next issue
22:3 scheduled for August 2019
Back volumes
Computer Science, Engineering, Management Science
Subscribe to Online

The Journal of Integrated Design and Process Science (JIDPS) is the official journal of the Society for Design and Process Science (SDPS). This journal publishes research findings covering transdisciplinary notions of design and process with a focus on issues that deal with 1) understanding of design and process  crossing boundaries of natural, human, and built environments,  2) principles, methods, and tools, and 3) applications of design and process science to engineering and social problems. The journal serves to promote research of transdisciplinary design and process science from different disciplines such as mathematics, computer science, economics, engineering, management science, natural sciences, and social sciences.

The journal is an archival peer-reviewed technical journal publishing the following papers: 1) research papers, 2) reports on case studies, 3) reports on major design and process projects, 4) design and process standards and proposals, 5) literature review, and 6) discussion and position papers that discuss the works published in the journal or present retrospections on critical and strategic issues in the transdisciplinary design and process science. 

Yong Zeng
Design Science
Concordia University, Montreal, Canada

Kyoung-yun Kim
Industrial and Systems Engineering
Wayne State University
Detroit, USA

Associate Editors

Gaetano Cascini
Department of Mechanical Engineering
Politecnico di Milano
Milano, Italy

Jingwei Huang
Systems Engineering
Old Dominion University, Norfolk, USA

Radmila Juric
Software Engineering
The University College of Southeast Norway, Norway

Honorary Editor
Peter A. Ng
Department of Computer Science
Indiana University Purdue University Fort Wayne, Fort Wayne, USA

Stephen Ekwaro-Osire
Mechanical Engineering
Texas Tech University, Lubbock, USA

Proof Editor

Mengting Zhao
Information Systems Engineering
Concordia University, Montreal, Canada

Editorial Board
A.A. Arntzen
The University College of Southeast Norway, Norway

A. Chakrabarti
Indian Institute of Science, Bangalore, India

C.-H. Chu
National Tsing Hua University, Hsinchu, Taiwan

E. Coatanéa
Tampere University of Technology, Tampere, Finland

F. Demoly
Univ. Bourgogne Franche-Comté, UTBM, France

A. Dogru
Middle East Technical University, Ankara, Turkey

R. De Guio
INSA de Strasbourg, France

I. Horváth,
Delft University of Technology, The Netherlands

G.E. Kremer
Iowa State University, USA

O. Kwon
Kyung Hee University, Seoul, South Korea

S. Liu
Central China Normal University, Wuhan, China

Y. Liu
Cardiff University, Cardiff, UK

S. McCahan
University of Toronto, Canada

V. Raskin
Purdue University, West Lafayette, USA

Y. Reich
Tel Aviv University, Tel Aviv, Israel

M. Steinert
Norwegian University of Science and Technology (NTNU), Trondheim, Norway

T. Tomiyama
Cranfield University, Cranfield. UK

T. Wan
University of Central Florida, Orlando, FL, USA

Senior Advisory Board 
Nam P. Suh
Former President of KAIST, S. Korea
Professor Emeritus, Massachusetts Institute of Technology, USA

Sang C. Suh
Computer Science
Texas A&M-Commerce, Texas, USA

Murat Tanik
Electrical Engineering
Wallace R. Bunn Chair of Telecommunications, The University of Alabama at Birmingham, USA

Raymond T. Yeh

Outreach Committee Chairs
Varadraj Prabhu
University of Central Florida, USA

David Robbins
Samford University, USA

Patrick HangHui Then
Swinburne University of Technology, Malaysia

Fan Xiong
Bio-Rad Laboratories, USA


By submitting my article to this journal, I agree to the IOS Press License to Publish: and the IOS Press Privacy Policy:

Submit to our online submission system at

Please click here to go the Author Order Form


Authors of published articles (non-prepress, final articles) will be contacted by Kudos. Kudos is a service that helps researchers maximize the impact and visibility of their research. It allows authors to enrich their articles with lay metadata, add links to related materials and promote their articles through the Kudos system to a wider public. Authors will receive no more than three emails: one invitation and a maximum of two reminders to register for the service and link the published article to their profile. Using and registering for Kudos remains entirely optional. For more information, please have a look at our authors section.


Would you like some pointers on how to help your research achieve a wider reach and greater impact? Please consult our Promotional Toolkit for Authors for tips.


Academic Source Complete
ACM Digital Library
EBSCO databases
Google Scholar
Science & Technology Collection
Ulrich's Periodicals Directory
Web of Science: Emerging Sources Citation Index

Eleven IOS Press journals selected for ESCI

29 Oct 2015 - IOS Press is delighted to announce that eleven of its journals will be included in the Emerging Sources Citation Index (ESCI), a new index to be launched by Thomson Reuters in November 2015. ...

SCImago Journal & Country Rank