Journal of Integrated Design & Process Science

Transactions of the SDPS

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ISSN print
1092-0617
ISSN online
1875-8959
Volume
23; 4 issues
Status
Last issue (22:4) online on 22 November 2019
Next issue
23:1 scheduled for February 2020
Back volumes
1-22
Website
www.sdpsnet.org
Subject
Computer Science, Engineering, Management Science
INSTITUTIONAL SUBSCRIPTION FOR 2019 €450 / US$550 Excluding VAT
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The Journal of Integrated Design and Process Science (JIDPS) is the official journal of the Society for Design and Process Science (SDPS). This journal publishes research findings covering transdisciplinary notions of design and process with a focus on issues that deal with 1) understanding of design and process  crossing boundaries of natural, human, and built environments,  2) principles, methods, and tools, and 3) applications of design and process science to engineering and social problems. The journal serves to promote research of transdisciplinary design and process science from different disciplines such as mathematics, computer science, economics, engineering, management science, natural sciences, and social sciences.

The journal is an archival peer-reviewed technical journal publishing the following papers: 1) research papers, 2) reports on case studies, 3) reports on major design and process projects, 4) design and process standards and proposals, 5) literature review, and 6) discussion and position papers that discuss the works published in the journal or present retrospections on critical and strategic issues in the transdisciplinary design and process science. 

Editor-in-Chief
Kyoung-yun Kim
Industrial and Systems Engineering
Wayne State University
Detroit, USA
E-mail: kykim@eng.wayne.edu

Co-Editors-in-Chief
Thomas Wan
Health Management and Informatics
University of Central Florida
Orlando, USA
E-mail: Thomas.Wan@ucf.edu

Imre Horváth
Cyber-Physical Systems Design
Delft University of Technology
Delft, The Netherlands
E-mail: I.Horvath@tudelft.nl

Associate Editors
Jingwei Huang
Systems Engineering
Old Dominion University, Norfolk, USA
Email: j2huang@odu.edu

Radmila Juric
Software Engineering
The University College of Southeast Norway, Norway
Email: Radmila.Juric@usn.no

Honorary Editors
Peter A. Ng
Department of Computer Science
Indiana University Purdue University Fort Wayne, Fort Wayne, USA
E-mail: ngp@ipfw.edu 

Stephen Ekwaro-Osire
Mechanical Engineering
Texas Tech University, Lubbock, USA
E-mail: stephen.ekwaro-osire@ttu.edu

Yong Zeng
Design Science
Concordia University, Montreal, Canada
E-mail: yong.zeng@concordia.ca

Publication Manager
Mengting Zhao
Information Systems Engineering
Concordia University, Montreal, Canada
E-mail: z_mengti@encs.concordia.ca

Editorial Board
A.A. Arntzen
The University College of Southeast Norway, Norway

Gaetano Cascini
Department of Mechanical Engineering, Politecnico di Milano, Milan, Italy

A. Chakrabarti
Indian Institute of Science, Bangalore, India

C.-H. Chu
National Tsing Hua University, Hsinchu, Taiwan

E. Coatanéa
Tampere University of Technology, Tampere, Finland

F. Demoly
Univ. Bourgogne Franche-Comté, UTBM, France

A. Dogru
Middle East Technical University, Ankara, Turkey

R. De Guio
INSA de Strasbourg, France

G.E. Kremer
Iowa State University, USA

O. Kwon
Kyung Hee University, Seoul, South Korea

S. Liu
Central China Normal University, Wuhan, China

Y. Liu
Cardiff University, Cardiff, UK

S. McCahan
University of Toronto, Canada

V. Gurupur
University of Central Florida, USA

V. Raskin
Purdue University, West Lafayette, USA

Y. Reich
Tel Aviv University, Tel Aviv, Israel

M. Steinert
Norwegian University of Science and Technology (NTNU), Trondheim, Norway

J. D. Summers
Clemson University, Clemson, USA

T. Tomiyama
Cranfield University, Cranfield. UK

Z. Zhang
Shanghai Jiaotong University, Shanghai, China

C. Zintgraff
The University of Texas at Austin, Austin, USA

Senior Advisory Board 
Nam P. Suh
Former President of KAIST, S. Korea
Professor Emeritus, Massachusetts Institute of Technology, USA

Sang C. Suh
Computer Science
Texas A&M-Commerce, Texas, USA

Murat Tanik
Electrical Engineering
Wallace R. Bunn Chair of Telecommunications, The University of Alabama at Birmingham, USA

Raymond T. Yeh
SDPS Fellow, USA

Outreach Committee Chairs
Yuri Borgianni
Free University of Bozen, Bolzano, Italy

Serkan Guldal
Adiyaman University, Turkey

Patrick HangHui Then
Swinburne University of Technology, Malaysia

David Robbins
Samford University, USA

Fan Xiong
Bio-Rad Laboratories, USA

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