Journal of Integrated Design & Process Science

Transactions of the SDPS

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JID cover
ISSN print
1092-0617
ISSN online
1875-8959
Volume
21; 4 issues
Status
Last issue (20:2) online on 22 July 2016
Next issue
20:3 scheduled for October 2016
Back volumes
1-20
Website
www.sdpsnet.org
Subject
Computer Science, Engineering, Management Science
Institutional subscription for 2017 €425 / US$550 Excluding VAT
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Call for Papers Special Issue on Systems Engineering. Click here for details. Submission Deadline: 7 March 2017.

The Journal of Integrated Design and Process Science (JIDPS) is the official journal of the Society for Design and Process Science (SDPS). This journal publishes research findings covering transdisciplinary notions of design and process with a focus on issues that deal with 1) understanding of design and process  crossing boundaries of natural, human, and built environments,  2) principles, methods, and tools, and 3) applications of design and process science to engineering and social problems. The journal serves to promote research of transdisciplinary design and process science from different disciplines such as mathematics, computer science, economics, engineering, management science, natural sciences, and social sciences.

The journal is an archival peer-reviewed technical journal publishing the following papers: 1) research papers, 2) reports on case studies, 3) reports on major design and process projects, 4) design and process standards and proposals, 5) literature review, and 6) discussion and position papers that discuss the works published in the journal or present retrospections on critical and strategic issues in the transdisciplinary design and process science. 

Editors-in-Chief
Y. Zeng, SDPS Fellow
Concordia Institute for Information Systems Engineering
Concordia University, Montreal, Canada
E-mail: yong.zeng@concordia.ca

S.C. Suh, SDPS Fellow
Department of Computer Science
Texas A&M University – Commerce, Commerce, USA
E-mail: sang.suh@tamuc.edu

Honorary Editor
P.A. Ng, SDPS Fellow
Department of Computer Science
Indiana University Purdue University Fort Wayne, Fort Wayne, USA
E-mail: ngp@ipfw.edu 

Associate Editors

Kyoung-yun "Joseph" Kim
Industrial and Systems Engineering
Wayne State University
Detroit, USA
E-mail: kykim@eng.wayne.edu

Gaetano Cascini
Department of Mechanical Engineering
Politecnico di Milano
Milano, Italy
E-mail: gaetano.cascini@polimi.it

Michael Goedicke
paluno, The Ruhr Institute for Software Technology Universität Duisburg-Essen Gerlingstraße 16
45127 Essen
Germany
Email: michael.goedicke@paluno.uni-due.de

Proof Editors

Thanh An Nguyen
Concordia Institute for Information Systems Engineering Concordia University Montreal, Canada

Suo Tan
Concordia Institute for Information Systems Engineering Concordia University Montreal, Canada

Editorial Board
A. Chakrabarti
Indian Institute of Science, Bangalore, India

C.-H. Chu
National Tsing Hua University, Hsinchu, Taiwan

E. Coatanéa
Tampere University of Technology, Tampere, Finland

A. Dogru, SDPS Fellow
Middle East Technical University, Ankara, Turkey

I. Horváth,
Delft University of Technology, The Netherlands

J. Huang
Old Dominion University, Norfolk, USA

K. Itoh, SDPS Fellow
Sophia University, Tokyo, Japan

R. Juric, SDPS Fellow
University of Westminster, London, UK

T.  Lim
Heriot-Watt University, Edinburgh, UK

Y. Liu
Cardiff University, Cardiff, UK

S. McCahan
University of Toronto, Canada

V. Raskin
Purdue University, West Lafayette, USA

Y. Reich
Tel Aviv University, Tel Aviv, Israel

M. Steinert
Norwegian University of Science and Technology (NTNU), Trondheim, Norway

T. Tomiyama, SDPS Fellow
Cranfield University, Cranfield. UK

T. Wan
University of Central Florida, Orlando, FL, USA

Senior Advisory Board 
S. Ekwaro-Osire
Whitacre College of Engineering
Texas Tech University, Lubbock, USA

C.V. Ramamoorthy, SDPS Fellow, Professor Emeritus
University of California at Berkeley, USA

Nam P. Suh, SDPS Fellow
Former President of KAIST, S. Korea
Professor Emeritus, Massachusetts Institute of Technology, USA

R. Yeh, SDPS Fellow
USA

Outreach Committee
Varadraj Prabhu (Co-chair)
University of Central Florida, USA

Patrick HangHui Then (Co-chair)
Swinburne University of Technology, Malaysia

Fan Xiong (Co-chair)
Bio-Rad Laboratories, USA

Cristiane Chaves Gattaz
Centro Universitário FEI, Brazil

Jerry A Higgs
AT&T Foundry, USA

John Tanik
Texas A&M University - Commerce

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