Thermal Challenges in Next Generation Electronic Systems
Proceedings of the THERMES 2002 Conference, Santa Fe, New Mexico, USA, January 13-16, 2002
- Imprint
- Millpress
- Editors
- Joshi, Y.K., Garimella, S.V.
- Pub. date
- January 2002
- Pages
- 416
- Binding
- hardcover
- ISBN
- 978-90-77017-03-6
- Subject
- Engineering
€140 / US$203
Excl. VAT
The editors present 44 papers that explore issues of thermal management in electronic products of a range of sizes, although the progression of shrinking system sizes is of particular concern. After the nine keynote and invited lectures the papers are organized under the following categories:
Challenges in micro- and nano-scale transport
Novel thermal management concepts
High heat flux transport
Transport in thermal management materials and across interfaces
Heat pipes and thermosyphons, compact models
Design methodologies
Analysis and testing methods